Industrial computing for real deployment
Fanless computers, embedded boards, and edge AI platforms for factory lines, vehicle systems, machine vision, and remote infrastructure.
Four COM ports, six USB 3.0 display interfaces, supporting dual independent displays with a maximum resolution of 4K UHD, six gigabit Ethernet ports controlled by independent chips, four serial ports, eight USB ports, and four PCI/PCIe expansion slots. Internal interfaces also include mini PCIe.
Built around proven industrial ecosystems
We work across processor, automation, and edge AI stacks so procurement and engineering teams can evaluate compatibility with fewer handoffs.
Processor Alliance
Long-life x86 roadmaps for embedded deployments
AI Acceleration
Jetson and GPU-ready edge inference platforms
Embedded Compute
Rugged boards and compact systems for OEM builds
Industrial Integration
Automation and protocol compatibility for plant systems
Platform families for industrial projects
NUC/Nano Motherboard
Fanless box PCs for cabinet, line-side, and outdoor control where dust, vibration, and service access matter.
3.5-inch Motherboard
Operator interfaces and panel systems for machine visualization, sealed environments, and production workflows.
All-in-one IPC
High-density platforms for control rooms, communication cabinets, gateways, and industrial integration layers.
Scalable Embedded Series
Compact accelerated systems for machine vision, video analytics, and edge AI inference at the point of capture.
Why Yantronic
We focus on the parts of industrial hardware selection that matter in practice: fit with existing systems, manageable revisions, and fewer surprises between sample approval and rollout.
Deployment continuity
Roadmap visibility, revision discipline, and consistent platform planning help reduce redesign risk across long programs.
Wide-temp reliability
Thermal design, metal enclosures, and industrial-grade component choices support harsh sites with tighter service windows.
Application-specific I/O
Serial, LAN, USB, display, GPIO, and expansion options make it easier to match legacy equipment and modern edge stacks.
Direct engineering access
Sales engineering, solution review, and configuration guidance keep projects moving from evaluation to pilot and rollout.
Deployment stories from the field
Designing an Edge AI Latency Budget for Real-World Inspection Lines
A practical method to split latency across camera capture, preprocessing, inference, and I/O signaling for stable industrial deployments.
Engineering resources
How to choose the right fanless system for factory deployment
Use case mapping for temperature, mounting, I/O, and lifecycle requirements.
Technical specifications for active industrial platforms
Compare CPU, memory, LAN, display, and expansion details.
Mechanical files for cabinet and chassis integration
3D references for enclosure planning and system fit checks.
Compliance documents for industrial and global deployment
Certification references for safety, EMC, and market access.
Choose the route that matches your project stage
Use this section like a project switchboard: start with engineering review, jump to direct contact, or move into technical downloads and case material.
Start with engineering review before you lock the platform.
Bring us the operating environment, I/O map, installation method, and target workload. We will help narrow the right industrial system path for sample, pilot, and rollout.
Platform selection
Review CPU roadmap, thermal envelope, expansion, and mounting constraints before sampling.
ODM / OEM scoping
Discuss enclosure changes, branding, interface adjustments, and accessory matching for customer programs.
Deployment review
Align documentation, pilot configuration, and production handoff for field rollout.
Reach the team directly.
Use direct contact when the project is already defined and you need a fast commercial or technical handoff.
Download what the team needs to evaluate.
Move from marketing copy to usable material with specs, guides, CAD references, and deployment stories.
Need help selecting a system?
Share your thermal envelope, target I/O, mounting constraints, and preferred compute platform. We will help narrow the right system architecture for evaluation and rollout.